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DANOPREN 500 80





DANOPREN 500 80 is a rigid extruded polystyrene (XPS) foam board with shiplap edges at various thicknesses. Manufactured without CFC's, HCFC's or HFC's. Designation Code for CE Marking:
XPS-EN13164-T1-CS(10\Y)500-WL(T)0,7-DS(70)

INTENDED USE

Thermal Insulation for Buildings (ThIB)
High load-bearing floors (cold stores, parking decks, etc).

PRESENTATION VALUE UNIT
Length 125 cm
Width 60 cm
Total thickness 80 mm
m2 per package 3.75 m2
Product Code 480104 -
TECHNICAL DATA VALUE UNIT STANDARD
Thickness 80 mm EN 823
Thickness tolerance -2/+3 mm EN 823
Length 125 cm EN 822
Length tolerance -8/+8 mm EN 822
Width 60 cm EN 822
Width Tolerance -8/+8 mm EN 822
Flatness 6 mm/m EN 825
Squareness 5 mm/m EN 824
Thermal conductivity (1) 0,034 W/mK EN 12667
Thermal Resistance 2.20 m2K/W EN 12667
Compression strength (2) ≥ 500 kPa EN 826
Compressive creep max 2% deflection after 50 years(3) ≥ 150 kPa EN 1606
Long-term water absorption by total immersion ≤ 0.7 Vol.% EN 12087
Long-term water absorption by diffusion ≤ 3 Vol.% EN 12088
Water absorption by freeze-thaw cycling ≤ 1 Vol.% EN 12091
Water vapour diffusion resistance factor (μ) (4) ≥ 80 - EN 12086
Dimensional Stability ≤ 5 % EN 1604
Reaction to fire E Euroclase EN 13501-01
Coefficient of linear thermal expansion 0,07 mm/m·K -
Working temperature range (Celsius degrees) -50 / +75 oC -
Specific heat 1.450 J/kg·K -
Nominal density 38 kg/m3 EN 1602
Capillarity Null - -
Edge treatment Shiplap - -
Surface Skinned - -

(1) Declared thermal conductivity λD according to EN 13164 (§ 4.2.1; Annex A; Annexes C.2 y C.4.1) _ EN 13164. Harmonized Technical Specification for factory made thermal insulation XPS foam products. Valid for CE marking and voluntary quality marks purposes. _

(2) Short-term (instant) test method; value reached at yield point or 10% deformation, whatever it comes first. _

(3) Creep: long-term deformation under constant loading _

(4) For skinned products it depends on thickness: the higher the thickness, the lesser the m-value